Lechpol
Tin vial 1mm LC60 FSW26 10g CYNEL alloy S-Sn60Pb40
SKU: 38622
EAN: 5902884600107
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Cynel tin with flux vial 1mm 10g S-Sn60Pb40
S-Sn60Pb40 solder alloy is produced in the first melt of tin and lead, in accordance with the requirements of PN-EN 29453:2000. Production is carried out in a continuous, controlled casting process without access to air, which effectively reduces the formation of impurities and oxidation of the metal. The alloy is then subjected to an extrusion process, which further ensures the homogeneous structure of the material and the elimination of oxides, translating into high quality and repeatability of soldering parameters.
S-Sn60Pb40 solder binder is widely used primarily in the electronics industry, in the manufacture of standard equipment and electronic components. It is also widely used in electrical engineering, as well as for soldering components coated with tin, tin-lead, cadmium, zinc and silver layers. Thanks to its good reflow properties, stable melting point and high reliability of connections, this alloy is suitable for many applications requiring durable and reliable solder joints.
Specification:
- Diameter: 1 mm
- Weight: 10 g
- Tin content: 59.5% to 60.5%
- Lead content: other
- Minimum purity of raw materials used: 99.90%
- Melting temperature: 183°C to 190°C
- Specific gravity: 8.65 g/cm3
- Operating temperature: 320°C to 420°C
Set contains:
- Tin vial 1mm LC60 10g Cynel
- Alloy composition: 59.5-60.5% tin, the remainder lead
- Minimum purity of raw materials 99.90%, guaranteeing stable soldering parameters
- Production from the first melt, in accordance with PN-EN 29453:2000
- Continuous casting process without air, limiting oxidation
- Melting temperature: 183-190°C, enabling easy and fast soldering
- High strength and durability of solder joints
- Diameter of 1 mm - universal for most assembly and service work
- Widely used in electronics, electrical engineering and soldering of components with tin, tin-lead, cadmium, zinc and silver coatings
S-Sn60Pb40 solder alloy is produced in the first melt of tin and lead, in accordance with the requirements of PN-EN 29453:2000. Production is carried out in a continuous, controlled casting process without access to air, which effectively reduces the formation of impurities and oxidation of the metal. The alloy is then subjected to an extrusion process, which further ensures the homogeneous structure of the material and the elimination of oxides, translating into high quality and repeatability of soldering parameters.
S-Sn60Pb40 solder binder is widely used primarily in the electronics industry, in the manufacture of standard equipment and electronic components. It is also widely used in electrical engineering, as well as for soldering components coated with tin, tin-lead, cadmium, zinc and silver layers. Thanks to its good reflow properties, stable melting point and high reliability of connections, this alloy is suitable for many applications requiring durable and reliable solder joints.
Specification:
- Diameter: 1 mm
- Weight: 10 g
- Tin content: 59.5% to 60.5%
- Lead content: other
- Minimum purity of raw materials used: 99.90%
- Melting temperature: 183°C to 190°C
- Specific gravity: 8.65 g/cm3
- Operating temperature: 320°C to 420°C
Set contains:
- Tin vial 1mm LC60 10g Cynel
- Alloy composition: 59.5-60.5% tin, the remainder lead
- Minimum purity of raw materials 99.90%, guaranteeing stable soldering parameters
- Production from the first melt, in accordance with PN-EN 29453:2000
- Continuous casting process without air, limiting oxidation
- Melting temperature: 183-190°C, enabling easy and fast soldering
- High strength and durability of solder joints
- Diameter of 1 mm - universal for most assembly and service work
- Widely used in electronics, electrical engineering and soldering of components with tin, tin-lead, cadmium, zinc and silver coatings
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Cynel tin with flux vial 1mm 10g S-Sn60Pb40
S-Sn60Pb40 solder alloy is produced in the first melt of tin and lead, in accordance with the requirements of PN-EN 29453:2000. Production is carried out in a continuous, controlled casting process without access to air, which effectively reduces the formation of impurities and oxidation of the metal. The alloy is then subjected to an extrusion process, which further ensures the homogeneous structure of the material and the elimination of oxides, translating into high quality and repeatability of soldering parameters.
S-Sn60Pb40 solder binder is widely used primarily in the electronics industry, in the manufacture of standard equipment and electronic components. It is also widely used in electrical engineering, as well as for soldering components coated with tin, tin-lead, cadmium, zinc and silver layers. Thanks to its good reflow properties, stable melting point and high reliability of connections, this alloy is suitable for many applications requiring durable and reliable solder joints.
Specification:
- Diameter: 1 mm
- Weight: 10 g
- Tin content: 59.5% to 60.5%
- Lead content: other
- Minimum purity of raw materials used: 99.90%
- Melting temperature: 183°C to 190°C
- Specific gravity: 8.65 g/cm3
- Operating temperature: 320°C to 420°C
Set contains:
- Tin vial 1mm LC60 10g Cynel
- Alloy composition: 59.5-60.5% tin, the remainder lead
- Minimum purity of raw materials 99.90%, guaranteeing stable soldering parameters
- Production from the first melt, in accordance with PN-EN 29453:2000
- Continuous casting process without air, limiting oxidation
- Melting temperature: 183-190°C, enabling easy and fast soldering
- High strength and durability of solder joints
- Diameter of 1 mm - universal for most assembly and service work
- Widely used in electronics, electrical engineering and soldering of components with tin, tin-lead, cadmium, zinc and silver coatings
S-Sn60Pb40 solder alloy is produced in the first melt of tin and lead, in accordance with the requirements of PN-EN 29453:2000. Production is carried out in a continuous, controlled casting process without access to air, which effectively reduces the formation of impurities and oxidation of the metal. The alloy is then subjected to an extrusion process, which further ensures the homogeneous structure of the material and the elimination of oxides, translating into high quality and repeatability of soldering parameters.
S-Sn60Pb40 solder binder is widely used primarily in the electronics industry, in the manufacture of standard equipment and electronic components. It is also widely used in electrical engineering, as well as for soldering components coated with tin, tin-lead, cadmium, zinc and silver layers. Thanks to its good reflow properties, stable melting point and high reliability of connections, this alloy is suitable for many applications requiring durable and reliable solder joints.
Specification:
- Diameter: 1 mm
- Weight: 10 g
- Tin content: 59.5% to 60.5%
- Lead content: other
- Minimum purity of raw materials used: 99.90%
- Melting temperature: 183°C to 190°C
- Specific gravity: 8.65 g/cm3
- Operating temperature: 320°C to 420°C
Set contains:
- Tin vial 1mm LC60 10g Cynel
- Alloy composition: 59.5-60.5% tin, the remainder lead
- Minimum purity of raw materials 99.90%, guaranteeing stable soldering parameters
- Production from the first melt, in accordance with PN-EN 29453:2000
- Continuous casting process without air, limiting oxidation
- Melting temperature: 183-190°C, enabling easy and fast soldering
- High strength and durability of solder joints
- Diameter of 1 mm - universal for most assembly and service work
- Widely used in electronics, electrical engineering and soldering of components with tin, tin-lead, cadmium, zinc and silver coatings
